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塑料的半导体激光焊接工艺研究
蔡锦达; 李翔; 王颖
2016
Source Publication电子科技
Issue10Pages:140
Abstract采用50 W半导体激光器进行塑料焊接实验。为了研究半导体激光对常见塑料的焊接工艺,以透明和不透明PMMA作为实验材料,通过控制变量法,分别单独改变实验过程中几个工艺参数,设计不同工艺焊接实验,寻找PMMA的最佳组合工艺参数范围。结果发现,焊接功率为10 W,焊接速度为20 mm/s,光斑直径为1.6 mm是其中一组优秀工艺参数组合。此外,在实验用激光器条件下,用于焊接PMMA的焊接功率不宜超过30 W。
Document Type期刊论文
Identifierhttp://ir.siom.ac.cn/handle/181231/28782
Collection其他
Affiliation中国科学院上海光学精密机械研究所
Recommended Citation
GB/T 7714
蔡锦达,李翔,王颖. 塑料的半导体激光焊接工艺研究[J]. 电子科技,2016(10):140.
APA 蔡锦达,李翔,&王颖.(2016).塑料的半导体激光焊接工艺研究.电子科技(10),140.
MLA 蔡锦达,et al."塑料的半导体激光焊接工艺研究".电子科技 .10(2016):140.
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