SIOM OpenIR  > 强场激光物理国家重点实验室
Tailored femtosecond Bessel beams for high-throughput, taper-free through-Silicon vias (TSVs) fabrication
He, Fei; Yu, Junjie; Chu, Wei; Wang, Zhaohui; Tan, Yuanxin; Cheng, Ya; Sugioka, Koji; ya.cheng@siom.ac.cn; ksugioka@postman.riken.jp
2016
Source PublicationLASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING (LAMOM) XXI
ISSN0277-786X
Department强光
AbstractFor higher-density integration and acceleration of operating speed in Si ICs, 3D integration of wafers and/or dies is essential. Fabrication of current 3D ICs relies on 3D assembly which electrically connects stacked chips to form a single circuit. A key technology for the 3D assembly is TSVs which are vertical electrical connections passing completely through silicon chips to electrically connect vertically assembled Si ICs. Typical TSVs have wide features, with diameters of a range from several microns to 50 mu m and depths up to 500 mu m with aspect ratios up to 15 depending on the application and integration scheme. In this work, we present high-throughput, taper-free TSVs fabrication using femtosecond Bessel beams operated at different wavelengths from 400 nm to 2.4 mu m. Furthermore, special phase filters are designed to suppress the damages induced by the side-lobes of Bessel beams for high-quality TSVs fabrication. Our technique can be potentially used for 3D assembly in manufacture of 3D silicon integrated circuits.
Language英语
Document Type会议论文
Identifierhttp://ir.siom.ac.cn/handle/181231/27376
Collection强场激光物理国家重点实验室
Corresponding Authorya.cheng@siom.ac.cn; ksugioka@postman.riken.jp
Recommended Citation
GB/T 7714
He, Fei,Yu, Junjie,Chu, Wei,et al. Tailored femtosecond Bessel beams for high-throughput, taper-free through-Silicon vias (TSVs) fabrication[C],2016.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[He, Fei]'s Articles
[Yu, Junjie]'s Articles
[Chu, Wei]'s Articles
Baidu academic
Similar articles in Baidu academic
[He, Fei]'s Articles
[Yu, Junjie]'s Articles
[Chu, Wei]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[He, Fei]'s Articles
[Yu, Junjie]'s Articles
[Chu, Wei]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.